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Advanced Multilayer PCB & Rigid Flex PCB manufacturer in China

We have more than 20 years of experience in the circuit board field
ProcessCapability-PCBRCY

Process Capability

Process Capability

【PCB Process Capability】

ITEM

TECHNICAL SPECIFICATION ILLUSTRATION
Layer Count 1-32 L 1 2 - Rigid PCB Process Capability
Base Material FR4 (TG135/TG150/TG170/CAF/CTI>600/halogen/halogen free)
Max.panel size 850mm*520m
Final Board Thickness 0.25mm-7.0mm 2 1 - Rigid PCB Process Capability
Tolerance of Final Board Thickness ± 10%(Thickness>1.0mm) ; ±0.1mm(Thickness<1.0mm) 3 1 - Rigid PCB Process Capability
Min line Width/Space 3mil/3mil(75um/75um)
Min hole to line Spacing 5mil(125um)for 2L,6mil(150um)for 4L,7mil(178um)for 6L and above 4 1 - Rigid PCB Process Capability
Minimum BGA clamping line 3.5mil(89um)
Copper thickness ⅓ – 4 oz(Inner Layer) ; ⅓ – 8 oz(Outer Layer)
Inter-layer alignment accuracy 2mil/2mil(50um/50um) 5 2 - Rigid PCB Process Capability
Min Hole Diamete ≥0.15mm( Mechanical hole);≥0.10mm( Laser hole)
Hole Diameter Tolerance ±0.075 mm(3mil)
Aspect ratio 12:1 6 1 - Rigid PCB Process Capability
Etching Tolerance ±10% / ±1.5mil
Solder Mask Thickness ≥1mil(≥25um)
Min Solder Mask Bridge 4mil (100um) 7 - Rigid PCB Process Capability
Solder Mask Plug Hole Max Diameter 0.6 mm
Surface Treatment HASL/LF-HASL,Gold Finger,Hard Gold,OSP,Immersion Gold,Immersion Tin,Immersion Silver
Gold Thickness 1-3u”( Immersin Gold) ;≤50u”(Hard Gold)
Impedance Control Tolerance ±10% 8 - Rigid PCB Process Capability
Warp and Twist ≤0.5% 9 1 - Rigid PCB Process Capability
Peel strength ≥107g/mm

【Rigid Flex PCB Production Process】

ITEM TECHNICAL SPECIFICATION ILLUSTRATION
Layer Count 2-18 L 1 2 - Rigid-flex PCB Process Capability
Base Material FR4 (TG135/TG150/TG170/CAF/CTI>600/halogen/halogen free) & FCCL(IT/Hongren/Taihong/DuPont/Panasonic)
Max.panel size 400mm*540m
Final Board Thickness 0.25-3.2mm 2 1 - Rigid-flex PCB Process Capability
Tolerance of Final Board Thickness ± 10%
Min line Width/Space 2mil/2mil(50um/50um) 3 1 - Rigid-flex PCB Process Capability
Min hole to line Spacing 5mil(125um)for 2L,6mil(150um)for 4L,7mil(178um)for 6L and above 4 1 - Rigid-flex PCB Process Capability
Minimum BGA clamping line 3.5mil(89um)
Copper thickness ⅓ – 1 oz(Inner Layer) ; ⅓ – 2 oz(Outer Layer)
Inter-layer alignment accuracy 2mil/2mil(50um/50um) 5 2 - Rigid-flex PCB Process Capability
Min Hole Diamete ≥0.1mm( Mechanical hole);≥0.075mm( Laser hole)
Hole Diameter Tolerance ±0.075 mm(3mil)
Aspect ratio 12:1 6 1 - Rigid-flex PCB Process Capability
Etching Tolerance ±10% / ±1.5mil
Solder Mask Thickness 10-30 um
Min Solder Mask Bridge 4mil (100um) 7 - Rigid-flex PCB Process Capability
Solder Mask Plug Hole Max Diameter 0.6 mm
Surface Treatment HASL/LF-HASL,Gold Finger,Hard Gold,OSP,Immersion Gold,Immersion Tin,Immersion Silver
Gold Thickness 1-3u”( Immersin Gold) ;≤50u”(Hard Gold)
Impedance Control Tolerance ±10% 8 - Rigid-flex PCB Process Capability
Warp and Twist ≤0.5% 9 1 - Rigid-flex PCB Process Capability
Peel strength ≥107g/mm

【High frequency PCB Production Process】

ITEM TECHNICAL SPECIFICATION TECHNICAL ILLUSTRATION
Base Material PTFE, hydrocarbon, resin, other types PTFE + ceramic,
PTFE + glass fiber + ceramic, PTFE + glass fiber
HF 1 - High frequency PCB process capability
Layer Layer Count 16 L HF 3 - High frequency PCB process capability
Shape tolerance Max.panel size 720*650 mm
Shape tolerance ±0.10 mm
Hole size tolerance Ordinary hole ±0.1; Short hole ±0.13
Pressing ability Interlayer alignment accuracy 3 mil 5 2 - High frequency PCB process capability
Pressing and mixing capacity PTFE+hydrocarbon ceramics+Fr4
Hole processing technology Min Hole Diamete 0.3 mm
Minimum hole wall spacing 0.65mm
Hole Diameter Tolerance ±0.075 mm HF 5 - High frequency PCB process capability
Plating capacity Max. aspect ratio 12:1 6 1 - High frequency PCB process capability
Hole copper uniformity COV≤7%
Resin plug hole Resin plug hole aspect ratio 12:1
Hole processing type Through hole/blind buried hole HF 3 1 - High frequency PCB process capability
Line width control Line width tolerance ±1.5mil 3 1 - High frequency PCB process capability
Impedance Control Impedance Control Tolerance ±10% 8 - High frequency PCB process capability
Warp and Twist Warp and Twist 0.75%
Special process POFV (VIPPO), mixed pressure, partial mixed pressure, length/grading/segment gold finger, step groove, back drill, sidewall metallization, N+N structure, double-sided crimping mechanical blind hole, local thick copper, high temperature Pressing, copper paste/silver paste plug hole, skip hole HF 41 - High frequency PCB process capability
Material Material Cooperative Brand Shengyi (LNB33), Lianmao, Taiyao, Panasonic (M4, M6 series)
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